Thermal Conductive Grease Paste Silicone GD900 Heatsink High Performance Compound for CPU CN30

Decription: Features Specific Gravity: 2.3 G/Cc Thermal Conductivity: 4.8 W/M-K Operating Temperature: -58~392 Degrees Fahrenheit GD900 thermal paste selects much more tiny particle diameter metal oxide as the main materials, used for filling the gape between the heat source and heat sink device. Its outstanding performance on the CPU GPU LED will meet your high standard demand for cooling system. Product features: Apply to REACH and RoHS environmental protection requirements. High thermal conductivity, effective insulation, high temperature resistant, low oil departs non-corrosive. Working principle: Fill the gape between heating element and the cooling device; Increase the contact area, so as to achieve the soundest effect of thermal conductivity. Method of use: It's normal phenomena, there is a little silicone oil floating above. Please stir well before use. Keep be painted surface clean, and painted directly with tools (such as syringe, scraper, finger cot, etc.) Warm notice: Keep children away from it. If swallowed or inadvertently come into eyes, ear, nose, mouth. Brush with clean water or send to hospital when necessary. Storage: Normal temperature preservation. Please cover it after using, avoid impurities such as dust, which will have effect of thermal conductivity. Included: 1 x Thermal Conductive Grease Paste